Bond zone model for a conductive crack at the interface of piezoelectric materials under anti‐plane mechanical and in‐plane electric loadings-Reference-Cited by-同舟云学术

Bond zone model for a conductive crack at the interface of piezoelectric materials under anti‐plane mechanical and in‐plane electric loadings

Published:2019-06-18 Issue:9 Volume:99 Page:
ISSN:0044-2267
Container-title:ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik
language:en
Short-container-title:Z. Angew. Math. Mech.

Author:

Onopriienko Oleg¹²,Loboda Volodymyr²,Sheveleva Alla³,Lapusta Yuri¹

Affiliation:

1. Université Clermont Auvergne, CNRS, SIGMA Clermont, Institut Pascal F‐63000 Clermont‐Ferrand France

2. Department of Theoretical and Computational MechanicsOles Honchar Dnipro National University Gagarin Av., 72 Dnipro 49010 Ukraine

3. Department of Computational MathematicsOles Honchar Dnipro National University Gagarin Av., 72 Dnipro 49010 Ukraine

Funder

Agence Nationale de la Recherche

Publisher

Wiley

Subject

Applied Mathematics,Computational Mechanics

Link

Reference37 articles.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献