Antiplane interface crack between two bonded dissimilar piezoelectric layers
Author:
Publisher
Elsevier BV
Subject
General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference28 articles.
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3. Energy-release rates and path-independent integrals in electroelastic crack propagation;Dascalu;Int. J. Engrg. Sci.,1994
4. Closed form solutions for partially debonded circular inclusion in piezoelectric materials;Deng;Acta Mech.,1999
5. The effects of crack face boundary conditions on the fracture mechanics of piezoelectric solids;Dunn;Eng. Fracture Mech.,1994
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