Electrical Modeling and Design for 3D System Integration

Author:

Li Er-Ping

Publisher

John Wiley & Sons, Inc.

Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Fast SIE Solver With Cut Set Analysis and Terminals as Supernodes for Interconnects;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-09

2. Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

3. Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity;IEEE Transactions on Electromagnetic Compatibility;2024-02

4. Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package;IEEE Transactions on Electromagnetic Compatibility;2023-12

5. Quasi-coaxial Through-Silicon via for Crosstalk Noise Suppression of 3D Integrated Microsystems;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13

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