Rice husk-derived porous carbon/silica particles as green filler for electronic package application
Author:
Affiliation:
1. Department of Chemistry; National Cheng Kung University; Tainan 701 Taiwan
2. Material Lab, Advanced Semiconductor Engineering. Inc; Nantze Export Processing Zone; Nantze Kaohsiung 811 Taiwan
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.44699/fullpdf
Reference31 articles.
1. Chemistry, Formulation, and Properties of Adhesives
2. An improvement of thermal conductivity of underfill materials for flip-chip packages
3. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
4. Thermal conductivity enhancement with different fillers for epoxy resin adhesives
5. Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
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4. Experimental and Computational Analysis of Thermal Characteristics of Polymer Resin Reinforced with Rice Husk and Aluminium Nitride Filler Composites;Journal of The Institution of Engineers (India): Series D;2023-04-13
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