On the Mechanism of Electroless Copper Deposition
Author:
Publisher
Wiley
Subject
General Chemical Engineering
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/bbpc.19870910609/fullpdf
Reference22 articles.
1. Interactions in Mixed Potential Systems
2. The Use of Organic Additives to Stabilize and Enhance the Deposition Rate of Electroless Copper Plating
3. Microstructure and ductility of electroless copper deposits
4. H. Wiese K. G. Weil
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