Interfacial Band Engineering of MoS 2 /Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts-Reference-Cited by-同舟云学术

Interfacial Band Engineering of MoS 2 /Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts

Published:2020-03-18 Issue:5 Volume:6 Page:2000110
ISSN:2199-160X
Container-title:Advanced Electronic Materials
language:en
Short-container-title:Adv. Electron. Mater.

Author:

Matković Aleksandar¹^ORCID,Petritz Andreas²³^ORCID,Schider Gerburg²^ORCID,Krammer Markus⁴,Kratzer Markus¹^ORCID,Karner‐Petritz Esther²³,Fian Alexander²,Gold Herbert²^ORCID,Gärtner Michael⁵^ORCID,Terfort Andreas⁵^ORCID,Teichert Christian¹^ORCID,Zojer Egbert⁴^ORCID,Zojer Karin⁴^ORCID,Stadlober Barbara²^ORCID

Affiliation:

1. Institute of Physics Montanuniversität Leoben Franz Josef Strasse 18 Leoben 8700 Austria

2. JOANNEUM RESEARCH Forschungsgesellschaft mbH Institute for Surface Technologies and Photonics ‐ MATERIALS Franz‐Pichler Straße 30 Weiz 8160 Austria

3. Sekitani Lab. Institute of Scientific and Industrial Research Osaka University 8‐1 Mihogaoka Osaka Ibaraki 567‐0047 Japan

4. Institute of Solid State Physics, NAWI Graz Graz University of Technology Petersgasse 16 Graz 8010 Austria

5. Institut für Anorganische und Analytische Chemie Goethe‐University Frankfurt Max‐von‐Laue‐Str. 7 Frankfurt am Main 60438 Germany

Funder

Deutsche Forschungsgemeinschaft

Austrian Science Fund

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aelm.202000110