Fully Transparent Epitaxial Oxide Thin‐Film Transistor Fabricated at Back‐End‐of‐Line Temperature by Suboxide Molecular‐Beam Epitaxy

Author:

Hensling Felix V.E.1ORCID,Vogt Patrick12,Park Jisung1,Shang Shun‐Li3,Ye Huacheng4,Wu Yu‐Mi5,Smith Kathleen6,Show Veronica7,Azizie Kathy1,Paik Hanjong178,Jena Debdeep16,Xing Huili G.16,Suyolcu Y. Eren15,van Aken Peter A.5,Datta Suman4,Liu Zi‐Kui3,Schlom Darrell G.1910

Affiliation:

1. Department of Materials Science and Engineering Cornell University Ithaca NY 14853 USA

2. Institut für Festkörperphysik Universität Bremen 28359 Bremen Germany

3. Department of Materials Science and Engineering The Pennsylvania State University University Park PA 16802 USA

4. Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA

5. Max Planck Institute for Solid State Research Heisenbergstraße 1 70569 Stuttgart Germany

6. School of Electrical and Computer Engineering Cornell University Ithaca NY 14853 USA

7. Platform for the Accelerated Realization Analys, and Discovery of Interface Materials (PARADIM) Cornell University Ithaca NY 14853 USA

8. School of Electrical and Computer Engineering University of Oklahoma Norman OK 73019 USA

9. Kavli Institute at Cornell for Nanoscale Science Ithaca NY 14853 USA

10. Leibniz‐Institut für Kristallzüchtung 12849 Berlin Germany

Abstract

AbstractTransparent oxide thin film transistors (TFTs) are an important ingredient of transparent electronics. Their fabrication at the back‐end‐of‐line (BEOL) opens the door to novel strategies to more closely integrate logic with memory for data‐intensive computing architectures that overcome the scaling challenges of today's integrated circuits. A recently developed variant of molecular‐beam epitaxy (MBE) called suboxide MBE (S‐MBE) is demonstrated to be capable of growing epitaxial In2O3 at BEOL temperatures with unmatched crystal quality. The fullwidth at halfmaximum of the rocking curve is 0.015° and, thus, ≈5x narrower than any reports at any temperature to date and limited by the substrate quality. The key to achieving these results is the provision of an In2O beam by S‐MBE, which enables growth in adsorption control and is kinetically favorable. To benchmark this deposition method for TFTs, rudimentary devices were fabricated.

Funder

National Science Foundation

Semiconductor Research Corporation

Air Force Research Laboratory

Alexander von Humboldt-Stiftung

Publisher

Wiley

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