Oxygen Scavenging in HfZrOx‐Based n/p‐FeFETs for Switching Voltage Scaling and Endurance/Retention Improvement

Author:

Kim Bong Ho1,Kuk Song‐Hyeon1,Kim Seong Kwang1,Kim Joon Pyo1,Suh Yoon‐Je1,Jeong Jaeyong1,Geum Dae‐Myeong1,Baek Seung‐Hyub2,Kim Sang Hyeon1ORCID

Affiliation:

1. School of Electrical Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon 34141 Republic of Korea

2. Electronic Materials Research Center Korea Institute of Science and Technology (KIST) Seoul 02792 Republic of Korea

Abstract

AbstractThe authors demonstrate improved switching voltage, retention, and endurance properties in HfZrOx (HZO)‐based n/p‐ferroelectric field‐effect transistors (FeFETs) via oxygen scavenging. Oxygen scavenging using titanium (Ti) in the gate stack successfully reduce the thickness of interfacial oxide between HZO and Si and the oxygen vacancy at the bottom interface of the HZO film. The n/p‐FeFETs with scavenging exhibit an immediate read‐after‐write with stable retention property and improved endurance property. In particular, n‐FeFET with scavenging exhibits excellent endurance property that does not show breakdown up to 1010 cycles. The charge trapping model in the n/p‐FeFETs is presented to explain why the effect of oxygen scavenging is more pronounced in n‐FeFET than in p‐FeFET. Finally, further switching voltage scaling potential is estimated by scavenging and HZO thickness scaling. It is believed that this work contributes to the development of low‐power FeFET and the understanding of FeFET operation.

Funder

Neurosciences Research Foundation

IC Design Education Center

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

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