Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer-Reference-Cited by-同舟云学术

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer

Published:2021-04-08 Issue:6 Volume:7 Page:2100002
ISSN:2199-160X
Container-title:Advanced Electronic Materials
language:en
Short-container-title:Adv. Electron. Mater.

Author:

Jeong Yunjo¹^ORCID,Douglas Ossie¹^ORCID,Misra Utkarsh²^ORCID,Tanjil Md Rubayat‐E¹^ORCID,Watanabe Kenji³^ORCID,Taniguchi Takashi⁴^ORCID,Wang Michael Cai¹⁵^ORCID

Affiliation:

1. Department of Mechanical Engineering University of South Florida Tampa FL 33620 United States

2. Department of Electrical Engineering University of South Florida Tampa FL 33620 United States

3. Research Center for Functional Materials National Institute for Materials Science 1‐1 Namiki Tsukuba 305‐0044 Japan

4. International Center for Materials Nanoarchitectonics National Institute for Materials Science 1‐1 Namiki Tsukuba 305‐0044 Japan

5. Department of Medical Engineering University of South Florida Tampa FL 33620 United States

Funder

Division of Civil, Mechanical and Manufacturing Innovation

Oak Ridge Associated Universities

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aelm.202100002

Reference46 articles.

1. Cramming More Components Onto Integrated Circuits

2. Power and Technology Scaling into the 5 nm Node with Stacked Nanosheets

3. Mitigating Electromigration in Physical Design

4. Y. X.Zhang L.Liang Y.Liu in201011th Int. Conf. Therm. Mech. Multi‐Physics Simulation Exp. Microelectron. Microsystems EuroSimE Bordeaux France2010 pp.1–7.

5. Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electromigration-Induced Evolution of Micromorphology and Electrical Properties in Gold Nanowires: Implications for Nanoelectronics;ACS Applied Nano Materials;2024-06-25

2. Strategy against electromigration-induced stress by passivation thickness design;Thin Solid Films;2023-11

3. Robust Self-Supervised Extrinsic Self-Calibration;2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS);2023-10-01

4. Lighting up NeRF via Unsupervised Decomposition and Enhancement;2023 IEEE/CVF International Conference on Computer Vision (ICCV);2023-10-01

5. SparsePose: Sparse-View Camera Pose Regression and Refinement;2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR);2023-06