Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP)
Author:
Affiliation:
1. HDMicroSystems
Publisher
John Wiley & Sons, Inc.
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119313991.ch14/fullpdf
Reference22 articles.
1. Innovation via photosensitive polyimide and poly(benzoxazole) percursors - a review by inventor;Rubner;Journal of Photopolymer Science and Technology,2004
2. A novel positive working photosensitive polymer for semiconductor surface coating;Makabe;Journal of Photopolymer Science and Technology,1997
3. Novel positive-type photosensitive polyimide coatings “PW-1000”;Tomikawa;Journal of Photopolymer Science and Technology,2000
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