A Strategy to Prepare High Tg and Low Cte Solder Resist Using Alkali-Soluble Photosensitive Polyimide

Author:

Lai Xingwang,Huang Shan,Zhang Jialin,Lv Xialei,Niu Fangfang,Li Jinhui

Publisher

Elsevier BV

Reference32 articles.

1. Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask;F Sun;Journal of Applied Polymer Science,2010

2. Synthesis of low viscosity, fast UV curing solder resist based on epoxy resin for inkjet printing;C Yang;Journal of Applied Polymer Science,2012

3. Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink-jet printing;Z Liang;Journal of Applied Polymer Science,2019

4. Toughness modification of cationic UV-cured cycloaliphatic epoxy resin by hydroxyl polymers with different structures;Y Xia;European Polymer Journal,2020

5. Cationic photopolymerization of bisphenol A diglycidyl ether epoxy under 385 nm;G Liu;Journal of Applied Polymer Science,2013

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