Synthesis of low viscosity, fast UV curing solder resist based on epoxy resin for ink-jet printing
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.38738/fullpdf
Reference18 articles.
1. Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages
2. Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
3. The properties of soldering mask hardened by means of UV using acrylate and methacrylate oligomers
4. Allergic Contact Dermatitis from Epoxy Resin in Solder Mask Coating in an Individual Working with Printed Circuit Boards
5. Synthesis and sensitive properties of poly-(bistriethylphosphine)-platinum-diethynylbenzene for organic vapor detection
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