Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform-Reference-Cited by-同舟云学术

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Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform

Published:2019-04-19 Issue: Volume: Page:55-76
ISSN:
Container-title:Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
language:
Short-container-title:

Author:

Meyer Thorsten¹,Kroehnert Steffen²

Affiliation:

1. Infineon Technologies AG; Germany

2. Amkor Technology Holding B.V.; Netherlands

Publisher

John Wiley & Sons, Inc.

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781119313991.ch3/fullpdf

Reference5 articles.

1. Kroehnert , S. 2017 Fan-Out SiP Solutions - WLSiP and WL3D Inaugural Conference and Exhibition on SYSTEM-IN-PACKAGE (SiP) TECHNOLOGY California, USA

2. Meyer , Th. Pressel , K. Ofner , G. Römer , B. 2010 System integration with eWLB Electronic System-Integration Technology Conference (ESTC) Berlin, Germany

3. Prashant , M. Liu , K. Jin , Y. 2010 Next generation eWLB (embedded wafer level BGA) packaging Electronics Packaging Technology Conference (EPTC) Singapore

4. Pressel , K. Beer , G. Meyer , T. 2010 Embedded wafer level ball grid array (eWLB) technology for system integration IEEE CPMT Symposium Japan

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1. The Influence of Heterogeneous RDL on the RF characteristic of Millimeter wave Phased Array Microsystem;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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