Combining Experimental and DFT Investigation of the Mechanism Involved in Thermal Etching of Titanium Nitride Using Alternate Exposures of NbF 5 and CCl 4 , or CCl 4 Only-Reference-Cited by-同舟云学术

Combining Experimental and DFT Investigation of the Mechanism Involved in Thermal Etching of Titanium Nitride Using Alternate Exposures of NbF 5 and CCl 4 , or CCl 4 Only

Published:2021-10-22 Issue:22 Volume:8 Page:2101085
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv. Mater. Interfaces

Author:

Sharma Varun¹²^ORCID,Kondati Natarajan Suresh³^ORCID,Elliott Simon D.⁴^ORCID,Blomberg Tom⁵^ORCID,Haukka Suvi¹,Givens Michael E.¹,Tuominen Marko¹,Ritala Mikko²^ORCID

Affiliation:

1. ASM Microchemistry Oy Pietari Kalmin katu 3 F2 Helsinki Uusimaa 00560 Finland

2. Department of Chemistry University of Helsinki Helsinki Uusimaa 00014 Finland

3. Department of Electrical Engineering and Automation Aalto University Espoo 02156 Finland

4. Schrödinger 120 West 45th Street New York NY 10036‐4041 USA

5. Department of Chemistry and Materials Science Aalto University Espoo Uusimaa 02150 Finland

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202101085

Reference52 articles.

1. Overview of emerging nonvolatile memory technologies

2. Industrial Applications of Atomic Layer Deposition

3. Atomic Layer Etching: An Industry Perspective

4. Atomic Layer Etching at the Tipping Point: An Overview

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