Integration of (Poly‐Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer‐Level MOEMS Fabrication Process

Author:

Helke Christian12,Seiler Jan12,Meinig Marco1,Großmann Toni Dirk12,Bonitz Jens1,Haase Micha12,Zimmermann Sven12,Ebermann Martin3,Kurth Steffen2,Reuter Danny12,Hiller Karla12

Affiliation:

1. Fraunhofer ENAS, Department Nano Device Technologies NDT Technologie‐Campus 3 Chemnitz 09126 Germany

2. Center for Microtechnologies ZfM Technische Universität Chemnitz Reichenhainer Straße 70 Chemnitz 09112 Germany

3. InfraTec GmbH Gostritzer Straße 61‐63, 01217 Dresden Germany

Abstract

This paper reports the development and integration of (Poly‐Si/Air)n Distributed BRAGG Reflectors (DBR) in a MOEMS Fabry‐Pérot‐Interferometer (FPI) concept. The realized reflectors constitute a promising and resource‐efficient alternative to complex Ion‐Assisted Deposition based DBRs while maintaining their advantages. Compared to state of the art MOEMS FPIs the (Poly‐Si/Air)n DBRs can be integrated into two moveable reflector carriers based on two individually fabricated wafers which are bonded. The (Poly‐Si/Air)n DBRs are investigated as (HL) and (HL)2 reflector stacks showing a reflectance above 91% within the wavelength range of 2.8–5.7 μm. © 2023 The Authors. IEEJ Transactions on Electrical and Electronic Engineering published by Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

Publisher

Wiley

Subject

Electrical and Electronic Engineering

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