Study on Flip‐Chip Structure of GaN‐Based Micro‐LED-Reference-Cited by-同舟云学术

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Study on Flip‐Chip Structure of GaN‐Based Micro‐LED

Published:2020-07 Issue:S1 Volume:51 Page:132-135
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Feng Yang¹,Liu Chuanbiao¹,Cheng Zhuo²,Liu Zhaojun¹

Affiliation:

1. Dept. of Electrical and Electronic EngineeringSouthern University of Science and Technology Shenzhen Guangdong China

2. Shenzhen CreatLED Technology Limited Shenzhen Guangdong China

Funder

Shenzhen Technical Project

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.13771

Reference13 articles.

1. Flip the Chip

2. Solid Logic Technology: Verdatile High Performance Microelectronics IBM;Davis E;[J]. Journal of Research & Development,1987

3. Resin‐Insertion Effect on Thermal Cycle Resis-tivity of Flip‐Chip Mounted LSI Devices;Nakano F;[J]. Journal of Research & Development,1987

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Micro solder bump detection of flip chip using improved decision tree model based on SAM image;Journal of Instrumentation;2022-10-01

2. Issue of spatial coherence in MQW based micro-LED simulation;Optics Express;2021-09-16

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