Additive Manufacturing of Micro‐Architected Copper based on an Ion‐Exchangeable Hydrogel

Author:

Ma Songhua1,Bai Wuxin1,Xiong Dajun1,Shan Guibin2,Zhao Zijie3,Yi Wenbin1,Wang Jieping14ORCID

Affiliation:

1. School of Chemistry and Chemical Engineering Nanjing University of Science and Technology Nanjing 210094 China

2. Herbert Gleiter Institute of Nanoscience School of Material Science and Engineering Nanjing University of Science and Technology Nanjing 210094 China

3. National Key Laboratory of Transient Physics Nanjing University of Science and Technology Nanjing 210094 China

4. State Key Laboratory of Powder Metallurgy Central South University Changsha 410083 China

Abstract

AbstractAdditive manufacturing (AM) of copper through laser‐based processes poses challenges, primarily attributed to the high thermal conductivity and low laser absorptivity of copper powder or wire as the feedstock. Although the use of copper salts in vat photopolymerization‐based AM techniques has garnered recent attention, achieving micro‐architected copper with high conductivity and density has remained elusive. In this study, we present a facile and efficient process to create complex 3D micro‐architected copper structures with superior electrical conductivity and hardness. The process entails the formulation of an ion‐exchangeable photoresin, followed by the utilization of digital light processing (DLP) printing to sculpt 3D hydrogel scaffolds, which were transformed into Cu2+‐chelated polymer frameworks (Cu‐CPFs) with a high loading of Cu2+ ions through ion exchange, followed by debinding and sintering, results in the transformation of Cu‐CPFs into miniaturized copper architectures. This methodology represents an efficient pathway for the creation of intricate micro‐architected 3D metal structures.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Wiley

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