Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing-Reference-Cited by-同舟云学术

Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing

Author:

Jo Yejin¹²,Park Hye Jin¹,Kim Young‐Bin³,Lee Sun Sook¹,Lee Su Yeon¹,Kim Sun‐Kyung³,Choi Youngmin¹²,Jeong Sunho⁴^ORCID

Affiliation:

1. Division of Advanced Materials Korea Research Institute of Chemical Technology (KRICT) 141 Gajeongro, Yuseong‐gu Daejeon 34114 Korea

2. Department of Chemical Convergence Materials Korea University of Science and Technology (UST) 217 Gajeongro, Yuseong‐gu Daejeon 34113 Korea

3. Department of Applied Physics Kyung Hee University Yongin‐si Gyeonggi‐do 17104 Korea

4. Department of Advanced Materials Engineering for Information and Electronics Kyung Hee University Yongin‐si Gyeonggi‐do 17104 Korea

Funder

National Research Foundation of Korea

Korea Research Institute of Chemical Technology

Publisher

Wiley

Subject

Electrochemistry,Condensed Matter Physics,Biomaterials,Electronic, Optical and Magnetic Materials

Link

Reference50 articles.

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献