Modeling and Simulation for Microelectronic Materials Research
Author:
Publisher
Wiley
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Reduction of Electromigration in Aluminum Films by Copper Doping
2. The metallurgical control of electromigration failure in narrow conducting lines
3. Direct Observation of the Effects of Cu Distribution on Electromigration Phenomena in Submicron Al Interconnects
4. The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects
5. Inhibition of Electromigration Damage in Thin Films
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Reducing Grain-Boundary Resistivity of Copper Nanowires by Doping;Physical Review Applied;2016-05-25
2. Nano-scale, planar and multi-tiered current pathways from a carbon nanotube–copper composite with high conductivity, ampacity and stability;Nanoscale;2016
3. Development of a Multi-Scale Electromigration Simulator Based on a Combination of Ultra Accelerated Quantum Chemical Molecular Dynamics and Kinetic Monte Carlo Methods Application to Cu Interconnects Lifetime Simulation;Japanese Journal of Applied Physics;2009-04-20
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