The use of 3D in‐mold decoration technology to form a film with printed circuits-Reference-Cited by-同舟云学术

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The use of 3D in‐mold decoration technology to form a film with printed circuits

Published:2020-08-05 Issue:10 Volume:60 Page:2517-2528
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

Wu Cheng‐Hsien¹^ORCID,Li Ji‐Huan¹

Affiliation:

1. Department of Mold and Die Engineering National Kaohsiung University of Science and Technology Kaohsiung Taiwan

Funder

Ministry of Science and Technology

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.25490

Reference16 articles.

1. Direct metal printing of 3D electrical circuit using rapid prototyping

2. Sub-micro to nanometer scale laser direct writing techniques with a contact probe

3. Direct micro-joining of flexible printed circuit and metal electrode by pulsed Nd:YAG laser

4. A review on 3D printed bioimplants

5. Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers

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1. In-Mold Heat Radiating Simulation and Verification of In-Mold Electronics;2024 IEEE Intelligent Vehicles Symposium (IV);2024-06-02

2. Based on wavelet-Lipschitz function for node detection method on armor subsequent damage optimization;The International Journal of Advanced Manufacturing Technology;2023-06-23

3. A Node Detection Method Based on Johnson–Cook and Thin-Film IMD Characteristic Model Armor Damage Detection Repair and Subsequent Optimization;Polymers;2022-10-26

4. Non-Dominant Genetic Algorithm for Multi-Objective Optimization Design of Unmanned Aerial Vehicle Shell Process;Polymers;2022-07-16

5. Microencapsulated Liquid Metals for the Autonomous Restoration of In-Mold Electronic Circuits;ACS Applied Electronic Materials;2022-02-04

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