Preparation and properties of heat and ultraviolet-induced bonding and debonding epoxy/epoxy acrylate adhesives-Reference-Cited by-同舟云学术

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Preparation and properties of heat and ultraviolet-induced bonding and debonding epoxy/epoxy acrylate adhesives

Published:2018-03-15 Issue:26 Volume:135 Page:46435
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Zhang Wenqing¹,Shentu Baoqing¹^ORCID,Weng Zhixue¹

Affiliation:

1. State Key Lab of Chemical Engineering, College of Chemical and Biological Engineering; Zhejiang University, 38 Zheda Road; Hangzhou 310027 China

Funder

Southern Taihu Elite Programme of Huzhou (China)

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference26 articles.

1. Towards woven logic from organic electronic fibres

2. Adhesive wafer bonding

3. Rule , J. D. Lewandowski , K. M. Determan , M. D. 2010

4. Paul , C. W. Carter , J. T. Morrison , B. D. 2007

5. Rapid Bonding/Debonding on Demand: Reversibly Cross-Linked Functional Polymers via Diels−Alder Chemistry

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3. Uniform rate debinding for Si3N4 vat photopolymerization 3D printing green parts using a specific-stage stepwise heating process;Additive Manufacturing;2024-03

4. Bonding and UV debonding behaviors of acrylate pressure-sensitive adhesives by rheological methods;Polymer Bulletin;2023-11-02

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