Bonding and UV debonding behaviors of acrylate pressure-sensitive adhesives by rheological methods-Reference-Cited by-同舟云学术

Bonding and UV debonding behaviors of acrylate pressure-sensitive adhesives by rheological methods

Published:2023-11-02 Issue: Volume: Page:
ISSN:0170-0839
Container-title:Polymer Bulletin
language:en
Short-container-title:Polym. Bull.

Author:

Wang Juan,Shi Weihe,Xiang Shanglin,Huang Han,Jiang Wanyuan,Chen Shuangjun^ORCID

Funder

Priority Academic Program Development of Jiangsu Higher Education Institutions

Science and Technology Plan Project of Wenzhou, China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Polymers and Plastics,Condensed Matter Physics,General Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s00289-023-05033-8.pdf

Reference39 articles.

1. Zhang X, He J, Yue L, Bai Y, Liu H (2019) Heat resistance of acrylic pressure-sensitive adhesives based oncommercial curing agents and UV/heat curing systems. J Appl PolymSci. https://doi.org/10.1002/app.47310

2. Huang W, Lin YC, Feng C (2021) Properties of high bonding force ultra-violet induced debonding adhesives film and application on process of flexible amoled modules lamination. J Appl Polym Sci 52:621–624

3. Ryu CM, Pang BL, Han JH, Kim HI (2012) Effect of photo-crosslinking on clean debonding of acrylicpressure sensitive adhesives from silicon wafer. J Photopolym Sci Technol 25:705–712. https://doi.org/10.2494/photopolymer.25.705

4. Sato E, Yamanishi K, Inui T, Horibe H, Matsumoto A (2015) Acetal-protected acrylic copolymers for dismantlable adhesives with spontaneous and complete removability. Polym 64:260–267. https://doi.org/10.1016/j.polymer.2015.01.057

5. Suyama K, Tachi H (2016) Direct rheological measurement of serial photopolymerization and photodegradation processes of pressure-sensitive adhesives composed of O-acyloxime-based photolabile crosslinkers and butyl acrylate. Prog Org Coat 100:94–99