Affiliation:
1. School of Mechanical Engineering Sungkyunkwan University Suwon Republic of Korea
2. Department of Materials Science and Engineering Center for Human‐oriented Triboelectric Energy Harvesting, Yonsei University Seoul Republic of Korea
3. Department of Advanced Materials Science and Engineering Sungkyunkwan University Suwon Republic of Korea
4. Department of Future Energy Engineering Sungkyunkwan University Suwon Republic of Korea
5. SKKU Institute of Energy Science & Technology (SIEST) Sungkyunkwan University Suwon Republic of Korea
Abstract
AbstractWith the development of electronic devices and wireless communication technology, the quality of human life has improved. However, shielding from electromagnetic interference (EMI) is required due to device malfunctions and harmful effects on human health. Polymer‐based shielding materials getting much attention due to their light weight, flexibility, good processability, and other desirable traits. However, achieving consistent dispersion of conductive fillers and optimizing the balance between electrical, mechanical, and thermal properties remain challenges despite the advantages of polymer‐based materials. Especially, epoxy resins are promising polymer materials for EMI shielding applications due to their excellent mechanical strength, chemical resistance, and excellent adhesive properties. Additionally, epoxy resin exhibits remarkable processability allowing for various fabrication techniques such as casting, molding, and three‐dimensional printing. However, one of the significant drawbacks of epoxy resin is the difficulty in achieving uniform dispersion of conductive fillers within the epoxy matrix. In this study, we propose an iron‐nickel alloy (FeNi) embedded in an epoxy matrix (FeNi/Epoxy) for EMI shielding material. It is manufactured by facile fabrication process due to the advantages of epoxy, which has excellent processability. EMI shielding effectiveness at 12 GHz is enhanced from 9.12 to 17.86 dB by the increase of FeNi concentrations. Furthermore, thermal and mechanical properties were improved by the increase of FeNi concentration. Thermal conductivity for efficient heat dissipation is increased from 0.63 to 1.49 Wm−1 K−1. Moreover, polydopamine (PDA) was employed as a surface coating material for FeNi to overcome the non‐uniform dispersion of FeNi particles in the epoxy matrix. Surface coating by PDA significantly enhanced the dispersion uniformity and strengthened the adhesion between the filler and matrix. Elastic modulus is greatly increased from 83.03 MPa to 1.29 GPa by the surface coating. The enhancement of mechanical properties is derived from the chemical bonds between the filler and matrix.
Funder
Korea Electric Power Corporation
Sungkyunkwan University
Ministry of Education