An on-wafer embedded passive device using chip-in-substrate packaging technology-Reference-Cited by-同舟云学术

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An on-wafer embedded passive device using chip-in-substrate packaging technology

Published:2015-06-26 Issue:9 Volume:57 Page:2060-2067
ISSN:0895-2477
Container-title:Microwave and Optical Technology Letters
language:en
Short-container-title:Microw. Opt. Technol. Lett.

Author:

Liang Junge G.¹,Kim Eun Seong¹,Wang Cong¹,Youn Je-Hyun²,Park Min Chul³,Kim Nam Young¹

Affiliation:

1. RFIC Center, Kwangwoon University; 447-1 Wolgye-dong Nowon-ku Seoul 139-701 Korea

2. Department of Electrical and Electronic Engineering; Yonsei University; 50 Yousei-ro, Seodaemun-ku Seoul 120-749 Korea

3. Sensor System Research Center; Korea Institute of Science and Technology; Hwarang-ro-14-gil, Seongbuk-Gu Seoul 139-791 South Korea

Funder

Basic Science Research Program and Nano-Material Technology Development Program through the National Research Foundation of Korea

Ministry of Science, ICT & Future Planning

Korean government

Research Grant of Kwangwoon University in 2014

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mop.29261/fullpdf

Reference18 articles.

1. High-performance integrated passive technology by advanced SI-GaAs-based fabrication for RF and microwave applications;Wang;Microwave Opt Technol Lett,2010

2. A novel method for the fabrication of integrated passive device on SI-GaAs substrate;Wang;Int J Adv Manuf Technol,2011

3. Practical IPD technology on GaAs-based substrate for microwave applications;Wang;Microwave J,2012

4. High performance WLAN balun using integrated passive technology on SI-GaAs substrate;Wang;Microwave Opt Technol Lett,2012

5. Design of high performance wilkinson power divider on SI-GaAs substrate using integrated passive technology;Wang;IETE J Res,2012

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1. Erratum for: An on-wafer embedded passive device using chip-in-substrate packaging technology;Microwave and Optical Technology Letters;2015-11-26

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