P‐60: Single‐Step Plasma‐Enhanced Chemical Vapor Deposition of Graphene on Cu Ink and Sputtered Cu Thin Films-Reference-Cited by-同舟云学术

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P‐60: Single‐Step Plasma‐Enhanced Chemical Vapor Deposition of Graphene on Cu Ink and Sputtered Cu Thin Films

Published:2020-08 Issue:1 Volume:51 Page:1565-1568
ISSN:0097-966X
Container-title:SID Symposium Digest of Technical Papers
language:en
Short-container-title:SID Symposium Digest of Technical Papers

Author:

Lu Chen-Hsuan¹,Leu Chyi-Ming²,Lee Tzong-Ming²,Yeh Nai-Chang³

Affiliation:

1. Department of Applied Physics and Materials Science California Institute of Technology Pasadena CA 91125 USA

2. Material and Chemical Research Laboratories Industrial Technology Research Institute Hsinchu 31057 Taiwan

3. Department of Physics California Institute of Technology Pasadena CA 91125 USA

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sdtp.14190

Reference15 articles.

1. The Realization of Redistribution Layers for FOWLP by Inkjet Printing

2. Inkjet printing technology for increasing the I/O density of 3D TSV interposers

3. Copper Metal for Semiconductor Interconnects;Cheng Y-L;Noble and Precious Metals: Properties, Nanoscale Effects and Applications,2018

4. Improvement of substrate and package warpage by copper plating process optimization

5. The rise of graphene

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Feasibility and Structural Transformation of Electrodeposited Copper Foils for Graphene Synthesis by Plasma‐Enhanced Chemical Vapor Deposition: Implications for High‐Frequency Applications;Advanced Materials Interfaces;2024-08-19

2. Low-Temperature Direct Growth of Nanocrystalline Multilayer Graphene on Silver with Long-Term Surface Passivation;ACS Applied Materials & Interfaces;2023-02-08

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