Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process-Reference-Cited by-同舟云学术

Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process

Published:2019-05-28 Issue:12 Volume:40 Page:4500-4509
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polym. Compos.

Author:

Demleitner Martin¹^ORCID,Sanchez‐Vazquez Sandra Aline¹,Raps Daniel¹,Bakis Gökhan¹,Pflock Tobias²,Chaloupka Alexander²,Schmölzer Stefan²,Altstädt Volker¹

Affiliation:

1. Department of Polymer EngineeringUniversity of Bayreuth Bayreuth Germany

2. Netzsch Gerätebau GmbH Wittelsbacherstraße 42, 95100 Selb Germany

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.25306

Reference44 articles.

1. A.Herrmann presented at Coompos Aust. CRC‐ACS Conf. Gold Coast 2015.

2. M.Kühnel T.Kraus presented at 1st Int. Compos. Congr. Stuttgart 2015.

3. RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approach

4. Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin

5. Critique of dielectric cure monitoring in epoxy resins – Does the method work for commercial formulations?

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