Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process
Author:
Affiliation:
1. Department of Polymer EngineeringUniversity of Bayreuth Bayreuth Germany
2. Netzsch Gerätebau GmbH Wittelsbacherstraße 42, 95100 Selb Germany
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.25306
Reference44 articles.
1. A.Herrmann presented at Coompos Aust. CRC‐ACS Conf. Gold Coast 2015.
2. M.Kühnel T.Kraus presented at 1st Int. Compos. Congr. Stuttgart 2015.
3. RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approach
4. Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin
5. Critique of dielectric cure monitoring in epoxy resins – Does the method work for commercial formulations?
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