Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin-Reference-Cited by-同舟云学术

Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin

Published:2018-03-23 Issue:12 Volume:56 Page:907-913
ISSN:0887-6266
Container-title:Journal of Polymer Science Part B: Polymer Physics
language:en
Short-container-title:J. Polym. Sci. Part B: Polym. Phys.

Author:

Chaloupka Alexander¹²^ORCID,Pflock Tobias¹,Horny Robert²,Rudolph Natalie³,Horn Siegfried R.²

Affiliation:

1. NETZSCH Gerätebau GmbH, Wittelsbacherstr. 42; Selb 95100 Germany

2. University of Augsburg, Chair of Experimental Physics II, Universitätsstr. 1; Augsburg 86159 Germany

3. Polymer Engineering Center, Department of Mechanical Engineering; University of Wisconsin-Madison; Madison Wisconsin 53706-1691

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry,Condensed Matter Physics

Reference16 articles.

1. G. R. Powell P. A. Crosby G. F. Fernando C. M. France R. C. Spooncer D. N. Waters Proc. SPIE 2444, Smart Structures and Materials 1995: Smart Sensing, Processing, and Instrumentation 1995 386

2. The development of a dielectric system for the on-line cure monitoring of the resin transfer moulding process

3. An Ultrasonic Sensor to Monitor the Mold Cavity Conditions During Injection Molding

4. On-line cure monitoring and viscosity measurement of carbon fiber epoxy composite materials

5. Monitoring the production of FRP composites: A review of in-line sensing methods

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