Affiliation:
1. Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibilities of High-Speed Electronic Systems; Shanghai Jiao Tong University; Shanghai 200240 China
Funder
National Basic Research Program of China
National Science Foundation of China
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Reference22 articles.
1. 2006 http://www.itrs.net/Links/2006update/2006Update.htm
2. Thermal characterization of electronic devices with boundary condition independent compact models;Lasance;IEEE Trans Comp Packag Manufact Technol A,1995
3. High-precision compact-thermal models;Sabry;IEEE Trans Comp Packag Technol,2005
4. Measurement and simulation of stacked die thermal resistances;Joiner;IEEE Trans Comp Packag Technol,2009
5. Methodology for thermal evaluation of multichip modules;Lall;IEEE Trans Comp Packag Manufact Technol A,1995
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献