Integrated Assembly and Photopreservation of Topographical Micropatterns-Reference-Cited by-同舟云学术

Integrated Assembly and Photopreservation of Topographical Micropatterns

Published:2021-08-12 Issue:37 Volume:17 Page:2103702
ISSN:1613-6810
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language:en
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Author:

Zhang Shuailong¹²³,Li Weizhen⁴,Elsayed Mohamed¹³,Peng Jiaxi¹²³,Chen Yujie⁵,Zhang Yanfeng⁵,Zhang Yibo⁶,Shayegannia Moein⁶,Dou Wenkun⁷,Wang Tiancong⁷,Sun Yu³⁶⁷,Kherani Nazir P.⁶⁸,Neale Steven L.⁴,Wheeler Aaron R.¹²³^ORCID

Affiliation:

1. Donnelly Centre for Cellular and Biomolecular Research University of Toronto Toronto ON M5S 3E1 Canada

2. Department of Chemistry University of Toronto Toronto ON M5S 3H6 Canada

3. Institute of Biomedical Engineering University of Toronto Toronto ON M5S 3G9 Canada

4. James Watt School of Engineering University of Glasgow Glasgow G12 8LT UK

5. State Key Laboratory of Optoelectronic Materials and Technologies School of Electronics and Information Technology Sun Yat‐sen University Guangzhou 510275 China

6. Department of Electrical and Computer Engineering University of Toronto Toronto ON M5S 3G4 Canada

7. Department of Mechanical and Industrial Engineering University of Toronto Toronto M5S 3G8 Canada

8. Department of Materials Science and Engineering University of Toronto Toronto ON M5S 3E4 Canada

Funder

Natural Sciences and Engineering Research Council of Canada

National Natural Science Foundation of China

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202103702

Reference52 articles.

1. Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

2. Transfer printing by kinetic control of adhesion to an elastomeric stamp

3. Full-colour quantum dot displays fabricated by transfer printing

4. Autonomous Robotic Pick-and-Place of Microobjects

5. Active Release of Microobjects Using a MEMS Microgripper to Overcome Adhesion Forces

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