High‐Pressure‐Sintering‐Induced Microstructural Engineering for an Ultimate Phonon Scattering of Thermoelectric Half‐Heusler Compounds-Reference-Cited by-同舟云学术

High‐Pressure‐Sintering‐Induced Microstructural Engineering for an Ultimate Phonon Scattering of Thermoelectric Half‐Heusler Compounds

Author:

He Ran¹,Zhu Taishan²,Ying Pingjun¹,Chen Jie³,Giebeler Lars¹,Kühn Uta¹,Grossman Jeffrey C.²,Wang Yumei³,Nielsch Kornelius¹⁴⁵^ORCID

Affiliation:

1. Leibniz Institute for Solid State and Materials Research 01069 Dresden Germany

2. Department of Materials Science and Engineering Massachusetts Institute of Technology Cambridge MA 02139 USA

3. Beijing National Laboratory for Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing 100190 China

4. Institute of Materials Science Technical University of Dresden 01062 Dresden Germany

5. Institute of Applied Physics Technical University of Dresden 01062 Dresden Germany

Funder

China National Funds for Distinguished Young Scientists

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

Reference58 articles.

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