Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy-Reference-Cited by-同舟云学术

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

Published:2022-10-13 Issue:46 Volume:18 Page:2204303
ISSN:1613-6810
Container-title:Small
language:en
Short-container-title:Small

Author:

Qian Yongxin¹,Luo Yubo¹,Haruna Abubakar Yakubu¹,Xiao Bo¹,Li Wang¹,Li You¹,Xiong Tianshun¹,Jiang Qinghui¹,Yang Junyou¹^ORCID

Affiliation:

1. State Key Laboratory of Material Processing and Die & Mould Technology School of Materials Science and Engineering Huazhong University of Science and Technology Wuhan 430074 P. R. China

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Huazhong University of Science and Technology

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202204303

Reference50 articles.

1. Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

2. Toward high-thermal-conductivity polymers

3. Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

4. High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN

5. Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates

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