Toward high-thermal-conductivity polymers
Author:
Funder
National Natural Science Foundation of China
Wuhan University of Science and Technology
Publisher
Elsevier BV
Subject
General Materials Science
Reference10 articles.
1. Molecular engineered conjugated polymer with high thermal conductivity;Xu;Sci. Adv.,2018
2. Fully organic bulk polymer with metallic thermal conductivity and tunable thermal pathways;Zhang;Adv. Sci.,2021
3. Nanostructured polymer films with metal-like thermal conductivity;Xu;Nat. Commun.,2019
4. High thermal conductivity of single polyethylene chains using molecular dynamics simulations;Henry;Phys. Rev. Lett.,2008
5. Polyethylene nanofibres with very high thermal conductivities;Shen;Nat. Nanotechnol.,2010
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