High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance-Reference-Cited by-同舟云学术

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High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Published:2021-08-12 Issue:38 Volume:17 Page:2102128
ISSN:1613-6810
Container-title:Small
language:en
Short-container-title:Small

Author:

Kim Taehun¹,Kim Seongkyun¹,Kim Eungchul¹,Kim Taesung¹²,Cho Jungwan¹,Song Changsik³,Baik Seunghyun¹^ORCID

Affiliation:

1. School of Mechanical Engineering Sungkyunkwan University Suwon 16419 Republic of Korea

2. SKKU Advanced Institute of Nanotechnology (SAINT) Sungkyunkwan University Suwon 16419 Republic of Korea

3. Department of Chemistry Sungkyunkwan University Suwon 16419 Republic of Korea

Funder

National Research Foundation of Korea

Ministry of Education

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202102128

Reference49 articles.

1. Thermal properties of graphene and nanostructured carbon materials

2. High thermal conductivity in cubic boron arsenide crystals

3. Co-designing electronics with microfluidics for more sustainable cooling

4. Fast mass transport-assisted convective heat transfer through a multi-walled carbon nanotube array

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