Author:
Singh Mrityunjay,Asthana Rajiv
Reference49 articles.
1. Advances in high-performance thermal management materials: a review;Zweben;J Adv Mater,2007
2. Materials selection issues for high operating temperature (HOT) electronic packaging
3. Advances in composite materials for thermal management in electronic packaging;Zweben;J Mater (JOM),1998
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