A study on the curing kinetics of epoxy molding compounds with various latent catalysts using differential scanning calorimetry-Reference-Cited by-同舟云学术

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A study on the curing kinetics of epoxy molding compounds with various latent catalysts using differential scanning calorimetry

Published:2017-05-15 Issue:35 Volume:134 Page:45252
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Lee Da Eun¹,Kim Hyun Woo¹,Kong Byung-Seon¹,Choi Hyung Ouk¹

Affiliation:

1. KCC Central Research Institute; 17-3, Mabungro240Beon-gil, Giheung-gu Yongin-si Gyeonggi-do 446-716 Korea

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference29 articles.

1. Effects of curing accelerators on physical properties of epoxy molding compound (EMC)

2. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

3. Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners

4. Modification of epoxy resin with siloxane containing phenol aralkyl epoxy resin for electronic encapsulation application

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1. Investigating the correlation between the curing behavior and properties of acrylic powder coatings;Journal of Coatings Technology and Research;2023-01-09

2. Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators;Polymers for Advanced Technologies;2022-06-15

3. Testing methods and design specifications for CFRP-prestressed concrete members: A review of current practices and case studies;Case Studies in Construction Materials;2022-06

4. THERMOSETTING BINDER FOR FIBROUS INSULATING MATERIALS;Russian Journal of Building Construction and Architecture;2021-11-19

5. Measurement of effective cure shrinkage of epoxy‐based molding compound by fiber Bragg grating sensor using two‐stage curing process;Journal of Applied Polymer Science;2021-09-10

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