Fused Deposition Modeling‐Based 3D‐Printed Electrical Interconnects and Circuits-Reference-Cited by-同舟云学术

Fused Deposition Modeling‐Based 3D‐Printed Electrical Interconnects and Circuits

Published:2021-09-27 Issue:12 Volume:3 Page:2100102
ISSN:2640-4567
Container-title:Advanced Intelligent Systems
language:en
Short-container-title:Advanced Intelligent Systems

Author:

Nassar Habib¹,Dahiya Ravinder¹^ORCID

Affiliation:

1. Bendable Electronics and Sensing Technologies (BEST) Group James Watt South Building, School of Engineering University of Glasgow Glasgow G12 8QQ UK

Funder

Engineering and Physical Sciences Research Council

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aisy.202100102

Reference58 articles.

1. Fingerprint‐Enhanced Capacitive‐Piezoelectric Flexible Sensing Skin to Discriminate Static and Dynamic Tactile Stimuli

2. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

3. 3D Printing multifunctionality: structures with electronics

4. Flexible Electronic Skin: From Humanoids to Humans [Scanning the Issue]

5. Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs

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