Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs-Reference-Cited by-同舟云学术

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Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs

Published:2019-10 Issue:10 Volume:107 Page:2016-2033
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Dahiya Ravinder^ORCID,Yogeswaran Nivasan,Liu Fengyuan,Manjakkal Libu,Burdet Etienne^ORCID,Hayward Vincent,Jorntell Henrik^ORCID

Funder

Engineering and Physical Sciences Research Council

H2020 Future and Emerging Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/5/8858047/08858052.pdf?arnumber=8858052

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