Oxidation of copper and mobility of copper ions during anodizing of an Al—1.5 wt.% Cu alloy-Reference-Cited by-同舟云学术

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Oxidation of copper and mobility of copper ions during anodizing of an Al—1.5 wt.% Cu alloy

Published:1995-12 Issue:13 Volume:23 Page:892-898
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Habazaki H.,Shimizu K.,Paez M. A.,Skeldon P.,Thompson G. E.,Wood G. C.,Xhou X.

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference16 articles.

1. and Corros. Sci., in press.

2. and Philos. Mag. B., in press.

3. The application of ultramicrotomy to the electronoptical examination of surface films on aluminium

4. Barrier-Type anodic films on aluminium in aqueous borate solutions: 1?Film density and stopping power of anodic alumina films for alpha particles

5. HIGH RESISTANCE ANODIC OXIDE FILMS ON ALUMINIUM

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