Revisiting a Cu-rich layer on the aluminum surface after twin-jet electropolishing-Reference-Cited by-同舟云学术

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Revisiting a Cu-rich layer on the aluminum surface after twin-jet electropolishing

Published:2024-01 Issue: Volume:207 Page:113501
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Yang Zhichao,Zheng Dehui,Wang Zhen,Liang Tingbin,Wang Shuangbao

Funder

National Natural Science Foundation of China

Natural Science Foundation of Yunnan Province

Major Science and Technology Projects in Yunnan Province

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference47 articles.

1. Developing a high-performance Al–Mg–Si–Sn–Sc alloy for essential room-temperature storage after quenching: aging regime design and micromechanisms;Pan;Rare Metals,2023

2. Effects of Sc on the vacancy and solute behaviours in aluminium;Zhang;J. Mater. Sci. Technol.,2023

3. Highly stable coherent nanoprecipitates via diffusion-dominated solute uptake and interstitial ordering;Xue;Nat. Mater.,2023

4. Analysis of the development of large area surface topography during ion etching;Barna;Vacuum,1990

5. Investigation of surface amorphization of silicon wafers during ion-milling;Schuhrke;Ultramicroscopy,1992

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