Analysis of wear, wear particles, and reduced inflammatory potential of vitamin E ultrahigh‐molecular‐weight polyethylene for use in total joint replacement
Author:
Affiliation:
1. Institute of Medical and Biological Engineering, University of Leeds, UK
2. Graduate School of Engineering, Kyoto University, Japan
3. R&D Centre, Nakashima Medical Co. Ltd, Japan
Publisher
Wiley
Subject
Biomedical Engineering,Biomaterials
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/jbm.b.32904
Reference34 articles.
1. The role of macrophages in osteolysis of total joint replacement
2. Bearing surface options for total hip replacement in young patients;Heisel C;Instr Course Lect,2004
3. KimYH OhSH KimJS. Primary total hip arthroplasty with a second‐generation cementless total hip prosthesis in patients younger than fifty years of age. J Bone Joint Surg Am2003;85–A(1):109–114.
4. Highly Cross-Linked Polyethylene
Cited by 58 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characteristics of VE/HXLPE wear particle morphology: A comparative analysis with UHMWPE in an in vitro artificial tibial insert simulation test;Wear;2024-06
2. In Vitro Wear of a Novel Vitamin E Crosslinked Polyethylene Lumbar Total Joint Replacement;Bioengineering;2023-10-15
3. Mechanism of regulating macrophages/osteoclasts in attenuating wear particle-induced aseptic osteolysis;Frontiers in Immunology;2023-10-04
4. Therapeutic effects of curcumin liposomes and nanocrystals on inflammatory osteolysis: In vitro and in vivo comparative study;Pharmacological Research;2023-06
5. In Vivo Performance of Vitamin E Stabilized Polyethylene Implants for Total Hip Arthroplasty: A Review;The Journal of Arthroplasty;2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3