Polyimide incorporated cyanate ester/epoxy copolymers for high-temperature molding compounds
Author:
Affiliation:
1. School of Materials Science and Engineering; Georgia Institute of Technology; 771 Ferst Drive, Atlanta Georgia 30332
2. Department of Electronic Engineering; The Chinese University of Hong Kong; Shanti Hong Kong
Funder
Georgia Tech 3D Packaging Research Center
Publisher
Wiley
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/pola.29214/fullpdf
Reference51 articles.
1. Survey of High-Temperature Reliability of Power Electronics Packaging Components
2. Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging
3. Materials for Advanced Packaging
4. Synthesis and application of epoxy resins: A review
5. Thermal degradation behaviors of epoxy resin/POSS hybrids and phosphorus-silicon synergism of flame retardancy
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