Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High <i>T</i><sub>g</sub>, Low CTE, and Intrinsic Flame Retardancy-Reference-Cited by-同舟云学术

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Published:2024-05-21 Issue:22 Volume:63 Page:9701-9714
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Huang Jiateng¹,Zhu Feiyu¹,Hu Wei¹,Li Xiaohan¹,Xie Qiunan¹,Fei Xiaoma²,Liu Jingcheng¹,Li Xiaojie¹,Wei Wei¹^ORCID

Affiliation:

1. Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, P. R. China

2. Wuxi Chuangda Advanced Materials Co., Ltd., Wuxi, Jiangsu 214028, P. R. China

Funder

Government of Jiangsu Province

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.4c00746

Reference54 articles.

1. Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

2. Polyimide incorporated cyanate ester/epoxy copolymers for high-temperature molding compounds

3. Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP

4. Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging

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