Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics-Reference-Cited by-同舟云学术

Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics

Published:2019-02-21 Issue:15 Volume:9 Page:1900037
ISSN:1614-6832
Container-title:Advanced Energy Materials
language:en
Short-container-title:Adv. Energy Mater.

Author:

Wang Yang¹²³,Su Songyang⁴,Cai Lejuan¹,Qiu Bocheng¹,Wang Ni³,Xiong Jie³,Yang Cheng⁴,Tao Xiaoming²,Chai Yang¹^ORCID

Affiliation:

1. Department of Applied PhysicsThe Hong Kong Polytechnic University Hung Hom Kowloon Hong Kong P. R. China

2. Institute of Textiles and ClothingThe Hong Kong Polytechnic University Hung Hom Kowloon Hong Kong P. R. China

3. State Key Laboratory of Electronic Thin Films and Integrated DevicesUniversity of Electronic Science and Technology of China Chengdu 610054 P. R. China

4. Division of Energy and EnvironmentGraduate School at ShenzhenTsinghua University Shenzhen 518055 P. R. China

Funder

Research Grants Council, University Grants Committee

Hong Kong Polytechnic University

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Publisher

Wiley

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/aenm.201900037

Reference41 articles.

1. Three-dimensional integrated stretchable electronics

2. 3D Microelectronic Packaging

3. Integrated circuit packaging review with an emphasis on 3D packaging

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