Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level-Reference-Cited by-同舟云学术

Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level

Published:2013-02-14 Issue:6 Volume:26 Page:560-572
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int. J. Numer. Model.

Author:

Chiariello Andrea G.¹,Maffucci Antonio²,Miano Giovanni³

Affiliation:

1. D.I.I., Second University of Naples; via Roma, 29 I-81031 Aversa Italy

2. D.I.E.I., University of Cassino and Southern Lazio; via G. di Biasio 43 I-03043 Cassino Italy

3. D.I.E.L., University of Naples Federico II; via Claudio 21 I-80125 Naples Italy

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Reference29 articles.

2. International Technology Roadmap for Semiconductors 2011 http://public.itrs.net

3. Carbon Based Electronics;Avouris;Nat Nanotechnol,2007

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