Inductive Peaking Technology for Bandwidth Enhancement in Carbon Nanotube Bundle Interconnect-Reference-Cited by-同舟云学术

Inductive Peaking Technology for Bandwidth Enhancement in Carbon Nanotube Bundle Interconnect

Published:2018-01-08 Issue:5 Volume:215 Page:1700459
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Phys. Status Solidi A

Author:

Zhao Songjie¹^ORCID,Pan Zhongliang¹

Affiliation:

1. School of Physics and Telecommunication Engineering South China Normal University; Guangzhou 510006 China

Funder

Guangdong Province Science and Technology Project

Natural Science Foundation of Guangdong Province

Guangzhou Science and Technology Program key projects

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference44 articles.

1. Performance and stability analysis of monolayer single-walled carbon nanotube interconnects

2. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

3. M. Sahoo P. Ghosal H. Rahaman Proc. IEEE Asia Symp. Quality Electronic Des 2013 264 273

4. Influence of tube diameter on carbon nanotube interconnect delay and power output

5. Analytical Time-Domain Models for Performance Optimization of Multilayer GNR Interconnects

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1. Analysis and Simulation of Various Parameters of Mixed CNT Bundle for Interconnect Applications;Sustainable Technology and Advanced Computing in Electrical Engineering;2022

2. Bandwidth expanding technology for dynamic crosstalk aware single-walled and multi-walled carbon nanotube bundle interconnects;Microelectronics Journal;2018-08