Hydrocarbon Incorporation Effect on the Electrical Properties of Low Dielectric Constant SiCOH Films Deposited with Tetrakis(trimethylsilyloxy)silane and Cyclohexane Precursors-Reference-Cited by-同舟云学术

Hydrocarbon Incorporation Effect on the Electrical Properties of Low Dielectric Constant SiCOH Films Deposited with Tetrakis(trimethylsilyloxy)silane and Cyclohexane Precursors

Published:2015-09-28 Issue:11 Volume:36 Page:2677-2681
ISSN:1229-5949
Container-title:Bulletin of the Korean Chemical Society
language:en
Short-container-title:Bull. Korean Chem. Soc.

Author:

Kim Hoonbae¹,Kang Wontak¹,Seo Hyun-Jin²,Jung Donggeun¹,Boo Jin-Hyo²

Affiliation:

1. Department of Physics and Institute of Basic Science; Sungkyunkwan University; Suwon 440-746 Republic of Korea

2. Department of Chemistry and Institute of Basic Science; Sungkyunkwan University; Suwon 440-746 Republic of Korea

Funder

Faculty Research Fund

Sungkyunkwan University

Publisher

Wiley

Subject

General Chemistry

Reference20 articles.

1. Low Dielectric Constant Materials for ULSI Interconnects

2. Low dielectric constant materials for microelectronics

3. Effects of Electron Irradiation on Deep Centers in High-Purity Semi-Insulating 6H-SiC

4. Plasma deposition of low-dielectric-constant fluorinated amorphous carbon

5. Infrared spectroscopy study of low-dielectric-constant fluorine-incorporated and carbon-incorporated silicon oxide films

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1. Influence of plasma parameters on low-k SiCOH film grown by plasma-enhanced chemical vapor deposition using dimethyldimethoxysilane;Vacuum;2023-11

2. Dielectric Characteristics of Low-Dielectric-Constant Plasma-Polymerized SiCOH Films Formed with Phenyltrimethoxysilane Precursor;Journal of Nanoscience and Nanotechnology;2017-10-01

3. Control of Cell Adhesiveness on Plasma Polymerized Thin Film Deposited with Tetrakis(trimethylsilyloxy)Silane and Cyclohexane Precursors;Journal of Biomaterials and Tissue Engineering;2017-09-01

4. Characterization of Low-k SiCOH Film Etching in Fluorocarbon Inductively Coupled Plasmas;Nanoscience and Nanotechnology Letters;2017-02-01