The compact d.c. electrothermal model of power MOSFETs for SPICE

Author:

Zarębski Janusz

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation

Reference33 articles.

1. Physically based compact device models for circuit modelling applications;Mawby;Microelectronics Journal,2001

2. Modeling and simulation of insulated-gate field-effect transistor switching circuits;Shichman;IEEE Journal of Solid-State Circuits,1968

3. Lallement C, Pecheux F, Grabinski W. High level description of thrmodynamical effects in the EKV 2.6 MOST model. 9-th International Conference Mixed Design of Integrated Circuits and Systems MIXDES 2002, Wrocław, 2002; 45-50.

4. Schurack E, Latzel T, Gottwald A. SPICE-simulation of nonlinear effects in field-effect-transistors caused by thermal power feedback. IEEE International Symposium on Circuits and Systems ISCAS 1993, vol. 2, Chicago, 1993; s. 1116-1119.

5. Laprade A, Pearson S, Benczkowski S, Dolny G, Wheatley F. A revised MOSFET model with dynamic temperature compensation. Application Note 7533, Fairchild Semiconductor, 2003.

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. 3D analysis of thermal and electrical performance of wide bandgap VDMOSFETs;Wide Bandgap Power Devices and Applications II;2017-08-23

2. Nonlinear modeling of LDMOS transistors for high-power FM transmitters;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2013-09-30

3. The Electrothermal Large-Signal Model of Power MOS Transistors for SPICE;IEEE Transactions on Power Electronics;2010-05

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