Heat‐resistant polyimides with low CTE and water absorption through hydrogen bonding interactions-Reference-Cited by-同舟云学术

Heat‐resistant polyimides with low CTE and water absorption through hydrogen bonding interactions

Published:2021-07-04 Issue:17 Volume:59 Page:1942-1951
ISSN:2642-4150
Container-title:Journal of Polymer Science
language:en
Short-container-title:Journal of Polymer Science

Author:

Chen Haiquan¹,Dai Fengna¹,Hu Mengjie¹,Chen Chunhai¹,Qian Guangtao¹,Yu Youhai¹^ORCID

Affiliation:

1. Center for Advanced Low‐Dimension Materials, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Material Science and Engineering Donghua University Shanghai China

Funder

Startup Foundation for Introducing Talent of Nanjing University of Information Science and Technology

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pol.20210305

Reference40 articles.

1. Polymers for flexible displays: From material selection to device applications

2. Efficient organometal trihalide perovskite planar-heterojunction solar cells on flexible polymer substrates

3. LTPS TFT Process on Polyimide Substrate for Flexible AMOLED

4. Superheat-resistant polymers with low coefficients of thermal expansion

5. Material challenge for flexible organic devices

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