Affiliation:
1. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Center for Advanced Low-dimension Materials, College of Material Science and Engineering, Donghua University, Shanghai, P. R. China
2. Collaborative Innovation Center for Civil Aviation Composites, Donghua University, Shanghai, P. R. China
Abstract
To provide polyimide (PI) with high heat resistance and ultra-low coefficient of thermal expansion (CTE) for use in flexible display substrates, a novel diamine with bisbenzimidazole and bisamide groups, namely N,N'-(1H,1'H-[5,5'-bibenzo[d]imidazole]-2,2'-diyl)bis(4-aminobenzamide) (BZBA), was designed and successfully synthesized. Several poly(benzimidazole-amide-imide) (PBIAI) films were prepared by thermal imidization with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 4,4'-oxydiphthalic anhydride (ODPA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), and 4,4'-(hexafluoroisopropylindene)-diphthalic anhydride (6FDA), respectively. Among them, BZBA-BPDA has a high glass transition temperatures ( Tg = 345 °C) while achieving an extremely low coefficients of thermal expansion (CTE = 1.9 ppm K−1), meeting the processing requirements of polymer flexible substrates in OLED devices. The effects of different dianhydrides on the performance of PBIAIs were compared, providing a meaningful reference for further adjusting the PI molecular structure to meet specific requirements for industrial polymer films.