All‐organic polymer blend dielectrics of poly (arylene ether urea) and polyimide: Toward high energy density and high temperature applications
Author:
Affiliation:
1. Institute of Electrical Engineering Chinese Academy of Science Beijing China
2. Department of Engineering and Science University of Chinese Academy of Sciences Beijing China
Funder
National Basic Research Program of China
Young Scientists Fund
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/pol.20200725
Reference30 articles.
1. Polymer-Based Dielectrics with High Energy Storage Density
2. Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability
3. Flexible high-temperature dielectric materials from polymer nanocomposites
4. Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications
5. Enhancement of the dielectric response in polymer nanocomposites with low dielectric constant fillers
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